SIM FLIP-TOP (C713)
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- Dimensions: 29.65LX17.20WX2.50H mm
- Weight: Approx. 1.01g
- Durability: 5,000 cycles Min.
- Contact resistance: 50mΩ typical, 100mΩ Max.
- IR reflow: 260℃.10Sec.Max
- Manual soldering: 370℃.3Sec.Max
SKU: C713
Category: SIM CARD CONNECTORS
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MICRO SIM FLIP-TOP (C791)
- Dimensions: 15.90LX14.90WX1.50H mm
- Weight: Approx. 0.53±0.2g
- Durability:5,000 cycles Min.
- Contact resistance: 50mΩ typical, 100mΩ Max.
- Insulation resistance: >1000mΩ /500V DC
- Vapor phase: 215℃.30Sec.Max
- IR reflow: 250℃.5Sec.Max
- Manual soldering: 370℃.3Sec.Max
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MICRO SIM PUSH-PULL (C781)
- Dimensions: 12.30LX10.00WX1.30H mm
- Weight: Approx. 0.30±0.2g
- Durability: 1500 cycles Min.
- Contact resistance: 50mΩ typical, 100mΩ Max.
- Insulation resistance: >1000mΩ /500V DC
- Vapor phase: 215℃.30Sec.Max
- IR reflow: 250℃.5Sec.Max
- Manual soldering: 370℃.3Sec.Max
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MUP-C782
MUP-C782
- Dimensions:29.65L*17.20W*2.50/2.80Hmm
- Weight:1.0g
- Contact principle:Friction technology
- Operating position:shaft up/down/horizontal
- Mounting system:SMT(post optional)
- Durability:5000 cycles min
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SIM PUSH-PUSH (C750)
- Dimensions: 26.50LX19.35WX1.80H mm
- Weight: Approx. 1.50±0.1g
- Durability: 5,000 cycles Min.
- Contact resistance: 50mΩ typical, 100mΩ Max.
- Insulation resistance: >1000mΩ /500V DC
- IR reflow: 260℃.10Sec.Max
- Manual soldering: 370℃.3Sec.Max
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MUP-C720
MUP-C720
Push-Push
- Dimensions:27.60L*18.70W*1.80Hmm
- Weight:1.2g
- Contact principle:Friction technology
- Operating position:shaft up/down/horizontal
- Mounting system:SMT(post optional)
- Durability:5000 cycles min
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DUAL SIM (C746)
- Dimensions: 17.50LX17.50WX3.00H mm
- Weight: Approx. 0.90±0.2g
- Durability: 5,000 cycles Min.
- Contact resistance: 50mΩ typical, 100mΩ Max.
- Insulation resistance: >1000mΩ /500V DC
- IR reflow: 250℃.5Sec.Max
- Manual soldering: 370℃.3Sec.Max
MICRO SIM PUSH-PUSH (C792)
- Dimensions:15.75LX17.17WX1.50H mm
- Weight: Approx. 0.4±0.1g
- Durability: 1,500 cycles Min.
- Contact resistance:
- Data contact: 150mΩ Max.
- CD switch: 500mΩ Max.
- Insulation resistance: >1000mΩ /500V DC
- Vapor phase: 215℃.30Sec.Max
- IR reflow: 250℃.5Sec.Max
- Manual soldering: 370℃.3Sec.Max
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MUP-C783
MUP-C783
- 6 PIN Nano Card
- SMT Type (without post)
- Single SIM
- Dimenseions: 13.30Lx10.60Wx1.35H mm
- Durability: Min 15000 cycles
- Operating Temperature:-40 ~ 85 Deg C
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SIM TRAY (C716)
- Dimensions: 33.07LX25.00WX3.00H mm
- Weight: Approx. 1.64±0.2g
- Durability: 5,000 cycles Min.
- Contact resistance: 50mΩ typical, 100mΩ Max.
- Insulation resistance: >1000mΩ /500V DC
- Vapor phase: 215℃.30Sec.Max
- IR reflow: 250℃.5Sec.Max
- Manual soldering: 370℃.3Sec.Max
MUP-C793
MUP-C793
- Dimensions:14.00L*13.30W*1.25Hmm
- Weight:0.42g
- Contact principle:Friction technology
- Operating position:shaft up/down/horizontal
- Mounting system:SMT(without post)
- Durability:2,000 cycles min
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