30 May 2022 Computer/Embedded Technology
Quectel Wireless Solutions has announced the launch of the SG865W-WF, a new generation of flagship Android smart module. The module is equipped with Qualcomm’s QCS8250 system-on-chip (SoC), which offers powerful performance and rich multimedia functions to cater for industrial and consumer artificial intelligence IoT (AIoT) scenarios where high computing power is required.
The SG865W-WF has a built-in 8-core, high-performance Kryo 585 CPU, Adreno 650 GPU, Adreno 995 DPU, Adreno 665 VPU, Hexagon DSP and Spectra 480 ISP. The module supports Wi-Fi 6, Bluetooth 5.1 and 2×2 Wi-Fi MIMO technology. A rich set of interfaces (such as LCM, camera, touch panel, I2S, PCIe, UART, USB, I2C and SPI) allow the module to serve a wide range of M2M applications, including video conferencing systems, live streaming devices, gaming, edge computing, AR/VR, intelligent retail and security systems. With the high degree of computing power available, the module is also capable of accelerating the deployment of high-end AIoT applications such as unmanned aerial vehicles and robots.
With AIoT becoming a new trend in IoT development, many devices not only need to achieve connections through the various wireless networks, they also require real-time analysis of the massive amount of data that is generated, in order to realise local decision-making and response capabilities. The SG865W-WF module can provide an optimal solution to the industry’s AIoT needs.